JPH0423136U - - Google Patents
Info
- Publication number
- JPH0423136U JPH0423136U JP6305090U JP6305090U JPH0423136U JP H0423136 U JPH0423136 U JP H0423136U JP 6305090 U JP6305090 U JP 6305090U JP 6305090 U JP6305090 U JP 6305090U JP H0423136 U JPH0423136 U JP H0423136U
- Authority
- JP
- Japan
- Prior art keywords
- holes
- leads
- semiconductor device
- type semiconductor
- insulating tape
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 9
- 239000008188 pellet Substances 0.000 claims description 2
- 239000011888 foil Substances 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 239000004973 liquid crystal related substance Substances 0.000 description 4
- 238000000926 separation method Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6305090U JPH0423136U (en]) | 1990-06-13 | 1990-06-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6305090U JPH0423136U (en]) | 1990-06-13 | 1990-06-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0423136U true JPH0423136U (en]) | 1992-02-26 |
Family
ID=31592759
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6305090U Pending JPH0423136U (en]) | 1990-06-13 | 1990-06-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0423136U (en]) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06124979A (ja) * | 1992-10-12 | 1994-05-06 | Sakae Denshi Kogyo Kk | 高密度実装回路基板の製造方法 |
-
1990
- 1990-06-13 JP JP6305090U patent/JPH0423136U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06124979A (ja) * | 1992-10-12 | 1994-05-06 | Sakae Denshi Kogyo Kk | 高密度実装回路基板の製造方法 |
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